1. 2. 3. material content data sheet sales product name tle8718sa issued 12. november 2015 ma# MA001392852 package pg-dso-36-54 weight* 2109.97 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 16.828 0.80 0.80 7975 7975 leadframe inorganic material phosphorus 7723-14-0 0.388 0.02 184 non noble metal zinc 7440-66-6 1.553 0.07 736 non noble metal iron 7439-89-6 31.066 1.47 14723 non noble metal copper 7440-50-8 1261.410 59.78 61.34 597834 613477 wire non noble metal copper 7440-50-8 8.583 0.41 0.41 4068 4068 encapsulation organic material carbon black 1333-86-4 1.523 0.07 722 plastics epoxy resin - 70.081 3.32 33214 inorganic material silicondioxide 60676-86-0 690.142 32.71 36.10 327086 361022 leadfinish non noble metal tin 7440-31-5 15.232 0.72 0.72 7219 7219 plating noble metal silver 7440-22-4 0.644 0.03 0.03 305 305 solder noble metal silver 7440-22-4 0.188 0.01 89 non noble metal tin 7440-31-5 0.125 0.01 59 non noble metal lead 7439-92-1 12.208 0.58 0.60 5786 5934 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
